Samsung Electronics wins $200 billion Broadcom AI chip partnership, boosting foundry push
Samsung Electronics secured a partnership with U.S. chip designer Broadcom worth over $200 billion, aimed at enhancing cooperation in memory chips and advanced packaging until 2030. This collaboration will leverage Broadcom's expertise in application-specific integrated circuits and Samsung's manufacturing capabilities, addressing the rising demand for custom AI chips. The deal is expected to boost utilization at Samsung's advanced manufacturing facilities and strengthen its position in the AI semiconductor market.